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Add manufacturing breakdown details #71

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ggael opened this issue Sep 28, 2022 · 3 comments
Open

Add manufacturing breakdown details #71

ggael opened this issue Sep 28, 2022 · 3 comments

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@ggael
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ggael commented Sep 28, 2022

Most PCF files provides breakdown details for the manufacturing part. They are, however, not always fully consistent on the partitioning. Here is the list I ended up on ecodiag's side:

  • packaging (PAIA)
  • chassis (PAIA desktop+laptops, a very very few HP monitors -> their mistake ?)
  • mainboard (PAIA+HPE)
  • daughterboard (HPE)
  • power supply unit (PAIA)
  • HDD (PAIA)
  • SSD (PAIA+HPE)
  • optical drive (PAIA)
  • display (PAIA laptops & AiO, but also a very few HP monitors -> their mistake ?)
  • battery (PAIA)
  • housing (PAIA monitors)
  • electronics (PAIA monitors + wise-thin-client)
  • panel (PAIA monitors)
  • assembly (Dell wise-thin-client, a very few HP laptops, many Lenovo laptops, HPE)
  • materials (Dell wise-thin-client, a very few HP laptops)
  • LCD assembly (1 dell + 2 HP laptops)
  • PWBs (2 HP laptops)
  • Integrated circuits (1 dell + 3 HP laptops)
  • chassis+PSU (HPE)
  • others (various HP)

This long list is conservative, but that's a lot ! So maybe some components could be merged together ?

For instance, when the PSU is combined with the chassis, maybe we could just put it to "others" since this does not provide much information.

Some other propositions:

  • Merge housing and chassis (their use is exclusive)
  • Merge display and panel (their use is exclusive)
  • Merge mainboard, daughterboard, IC and PWB within electronics ?
@ggael
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ggael commented Sep 28, 2022

After a short discussion, the initial idea would be to retain the most relevant parts only, and accumulate the rest to "others".

ggael pushed a commit that referenced this issue Sep 29, 2022
@AirLoren
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AirLoren commented Sep 30, 2022

At this time we have the following parts in the data model:

  • gwp_mainboard_ratio
  • gwp_daughterboard_ratio
  • gwp_psu_ratio
  • gwp_battery_ratio
  • gwp_hdd_ratio
  • gwp_ssd_ratio
  • gwp_opticaldrive_ratio
  • gwp_display_ratio
  • gwp_packaging_ratio
  • gwp_electronics_ratio
  • gwp_othercomponents_ratio
  • gwp_enclosure_ratio

I suggest to keep :

  • gwp_electronics_ratio including :
    • gwp_mainboard_ratio (including cpu and ram)
    • gwp_daughterboard_ratio
  • gwp_hdd_ratio
  • gwp_ssd_ratio
  • gwp_display_ratio
  • gwp_battery_ratio
  • gwp_othercomponents_ratio including all others components (enclosure, psu, opticaldrive & packaging)

AirLoren pushed a commit that referenced this issue Oct 28, 2022
@AirLoren
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I made the following changes to resolve this issue :

  • Change data model to match my suggestion above
  • Modify HPE parser (only one to parse manufacturing breakdown ratios)

@ggael could you modify piechart_analyser.py on the same way?

AirLoren pushed a commit that referenced this issue Oct 28, 2022
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