Version 1.0

Initial release

Features

• Simulation with Kokkos Serial, OpenMP, Cuda, and HIP backends
• Simulation of directional solidification: grain growth from a surface with a fixed thermal gradient and cooling rate
• Simulation of arrays of overlapping hemispherical spots with fixed thermal gradients and cooling rates
• Simulation with external thermal data for multi-layer additive manufacturing builds
• Grain structure output and analysis routines

Minimum dependency versions

• CMake minimum 3.9 required
• Kokkos minimum 3.0 required
• MPI required