Inverter PCBs
Pre-release
Pre-release
Inverter_Power PCB is sent to production (15-02-2024). PCB specifications:
- Base Material: FR-4
- Layers: 4
- Dimensions: 200 mm * 150 mm
- PCB Thickness: 1.6 mm
- Via Covering: Plugged
- Surface Finish: ENIG 1U"
- Outer Copper Weight: 2 oz (70um)
- Inner Copper Weight: 2 oz (70um)
- Minimum via hole size: 0.2mm
- Minimum clearance / track width: 0.2mm
- Remark: 1.10mm HOLES ARE FOR PRESS-FIT PART. USE (47.2MIL +/- 1MIL) DRILLED HOLES WITH A COPPER THICKNESS IN HOLE OF 25-50UM.
Inverter_Control PCB is sent to production (21-02-2024). PCB specifications:
- Base Material: FR-4
- Layers: 4
- Dimensions: 40 mm * 150 mm
- PCB Thickness: 1.6 mm
- Outer Copper Weight: 1 oz (35um)
- Inner Copper Weight: 1 oz (35um)
- Minimum via hole size: 0.2mm
- Minimum clearance / track width: 0.2mm
Errors already acknowledged:
- Inverter_Power should have been manufactured with Chemical Tin (Inmersion Tin) for the press-fit pins. ENIG is alright from what I have researched, but not the best for the contact life.
- In Inverter_Power' silkscreen, THE + AND - MARKS ARE REVERSED, BE CAREFUL
- In Inverter_Power, LDOs' pins 4 and 5 are swapped and need a dead-bug style rework for the LDOs to work according to design.
- Inverter_Power does not have any supply protection, and it really should.
- In Inverter_Control, BOOT0 (pin 94 of the MCU) should be connected to GND using a 10kR or similar value resistor.
- In Inverter_Control, EEPROM I2C nets should be pulled up using a value extracted from here. The testpoints TP292 and TP293 can be used for this purpose.
- Inverter_Control features a supply filter in the 20-30V bus, which could be better placed in the 5V bus.
- In Inverter_Control, Vbat must be connected to 3.3V