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@dweggg dweggg released this 15 Feb 14:56
· 364 commits to main since this release

Inverter_Power PCB is sent to production (15-02-2024). PCB specifications:

  • Base Material: FR-4
  • Layers: 4
  • Dimensions: 200 mm * 150 mm
  • PCB Thickness: 1.6 mm
  • Via Covering: Plugged
  • Surface Finish: ENIG 1U"
  • Outer Copper Weight: 2 oz (70um)
  • Inner Copper Weight: 2 oz (70um)
  • Minimum via hole size: 0.2mm
  • Minimum clearance / track width: 0.2mm
  • Remark: 1.10mm HOLES ARE FOR PRESS-FIT PART. USE (47.2MIL +/- 1MIL) DRILLED HOLES WITH A COPPER THICKNESS IN HOLE OF 25-50UM.

Inverter_Control PCB is sent to production (21-02-2024). PCB specifications:

  • Base Material: FR-4
  • Layers: 4
  • Dimensions: 40 mm * 150 mm
  • PCB Thickness: 1.6 mm
  • Outer Copper Weight: 1 oz (35um)
  • Inner Copper Weight: 1 oz (35um)
  • Minimum via hole size: 0.2mm
  • Minimum clearance / track width: 0.2mm

Errors already acknowledged:

  1. Inverter_Power should have been manufactured with Chemical Tin (Inmersion Tin) for the press-fit pins. ENIG is alright from what I have researched, but not the best for the contact life.
  2. In Inverter_Power' silkscreen, THE + AND - MARKS ARE REVERSED, BE CAREFUL
  3. In Inverter_Power, LDOs' pins 4 and 5 are swapped and need a dead-bug style rework for the LDOs to work according to design.
  4. Inverter_Power does not have any supply protection, and it really should.
  5. In Inverter_Control, BOOT0 (pin 94 of the MCU) should be connected to GND using a 10kR or similar value resistor.
  6. In Inverter_Control, EEPROM I2C nets should be pulled up using a value extracted from here. The testpoints TP292 and TP293 can be used for this purpose.
  7. Inverter_Control features a supply filter in the 20-30V bus, which could be better placed in the 5V bus.
  8. In Inverter_Control, Vbat must be connected to 3.3V