Footprint Libraries

An unofficial collection of PCB footprints for KiCad 6.

The kicad-unofficial/symbols repository defines schematic symbols that make use of these footprints.

3D Models

Official manufacturer 3D model files are associated with each footprint whenever they are made available to the public. Where an official footprint is not available the model may be created specifically for this library or obtained from a suitably open source such as SnapEDA.

Footprints that have 3D models are marked with a 🌐 (globe icon) in the footprint index below.

Enclosures

Some footprints represent PCB enclosures rather than parts to be placed on the PCB. They are marked with a 📦 (package icon) in the footprint index below.

Enclosure footprints define the edge cuts layer (PCB shape) and mounting holes.

Footprint Index

This is an index of the available libraries and the footprints they contain. Each library contains footprints for a specific vendor or manufacturer.

• BSC
• Espressif
• Hammond
• Microchip
• Nexperia
• onsemi
• TagConnect

BSC

• RJ-018 🌐 — low profile RJ-45 connector with LEDs

Espressif

• ESP32-WROVER 🌐 — ESP32 module • 18×31.4×3.3mm

Hammond

• 1551K 📦 — 1551 series • "K" variant • 80×40×20mm
• 1591XXL 📦 — 1591XX series • "L" variant • 86×56×36mm

Microchip

• TDFN-8-2x3-MN — TDFN-8 (MN) • 2×3×0.8mm 0.5P • 1.4×1.3mm exposed pad
• TDFN-8-2x3-MNY — TDFN-8 (MNY) • 2×3×0.8mm 0.5P • 1.4×1.3mm exposed pad • Ni/Pd/Au leads

Nexperia

• SOD882 🌐 — DFN1006-2 • 1×0.6mm 0.65P
• SOT353-1 🌐 — TSSOP-5 • MO-203 SC-88A • 2×1.25mm 0.65P
• SOT753 🌐 — TSOP-5 • SC-74A • 2.9×1.5mm 0.95P

onsemi

• 515AH 🌐 — WDFNW10 • 2.5×1mm 0.5P
• 517BB-01 🌐 — UDFN10 • 2.5×1mm 0.5P

TagConnect

• TC2030-NL — header for 6-pin plug-of-nails • no legs
• TC2030-NL+CLIP — header for 6-pin plug-of-nails • no legs • clearance for TC2030-CLIP
• TC2050-NL — header for 10-pin plug-of-nails • no legs
• TC2050-NL+CLIP — header for 10-pin plug-of-nails • no legs • courtyard for TC2050-CLIP

Notes for Footprint Creators

• Name the footprint after the manufacturers internal package name, include any standard package names in the description field.
• Always provide a link to the datasheet or technical specifications page, place the URL in parenthesis at the end of the description field.
• Hide REF** field on the silkscreen layer.
• Fit the REF** field on the fab layer within the component outline, if possible.
• Don't set clearance overrides, even if specified by the vendor.
• Include dimensions (D x E) in description (e.g. 2x1.25), omit trailing decimal zeroes
• Include nominal pitch (e) in description (e.g. 0.65P), omit trailing decimal zeroes