Launchpad F28069M with two DRV8305 Booster Packs - weight: 85g
- the Launchpad F28069M is optimized for high performance dual brushless motor control
- each Booster Pack drives one brushless motor with continuous current up to 15A (20A peak)
- max supply voltage 45V - we operate our robots at 24V
- Field Oriented Control (FOC) at 10kHz for each channel
- 1kHz control loop with realtime pc and can card
- CAN or USB communication
| Description | Details | Ordering Information | Comments |
|---|---|---|---|
| TI Launchpad F28069M | Launchpad Product Page | Mouser 595-LAUNCHXL-F28069M DigiKey 296-38832-ND |
Launchpad F28069M Overview |
| TI Booster Pack DRV8305EVM | Booster Pack Product Page | Mouser 595-STXL-DRV8305EVM DigiKey 296-43181-ND |
BOOSTXL-DRV8305EVM User’s Guide |
The TI Evaluation Board Electronics are used for the following robots:
Comparision: Micro Driver Electronics and TI Evaluation Boards
- we have developed a miniaturized version of the Texas Instruments motor driver cards called Micro Driver Electronics
- the micro driver electronics have the same capabilities as the TI evaluation boards
- the only difference is that the onboard USB flash programmer was removed - so for flashing the micro driver cards you need an external flash programmer
- the Micro Driver v2 board also features SPI communication for controlling the motors via the MasterBoard
- the micro driver cards are a factor of 10 smaller and a factor of 6 lighter
- more information: Micro Driver Electronics Documentation
- we use the digital GPIO pins to connect status leds
- connecting the GPIO 26 to ground will disable the motor drivers
- the launchpad has 16 analog input channels
- for each booster pack it measures the three phase voltages, the three phase currents and the supply voltage
- so there are only 2 analog channels free - ADCIN A6 and ADCIN B6
- Caution: Don't connect 5V sources to the analog input channels
- the maximal voltage for the analog input channels is 3,3V
TI Launchpad with jumper setting as delivered
Remove the jumpers JP1, JP2, JP4 and JP5.
Caution: Make sure that the jumpers JP1 and JP2 are removed when you connect the launchpad to USB and an external power supply.
This insulates your computer from the external power that is supplied through the booster backs.
Install jumper JP6 - make sure that JP7 and JP3 are also connected
Connector interface TI Evaluation Boards after modification.
We modify the connectors of the TI Evaluation Boards in order to make them compatible with our actuator module connector interface.
Prepare the encoder wires and a 5 pole Hirose connector.
Solder the wires to the Hirose connector.
Pin assignment Hirose connector.
Apply thin heat shrink to the red and yellow wire.
Apply a larger heat shrink around all the wires.
Repeat the steps and prepare the second cable.
Find the encoder pins on your launchpad.
The two ports are labeled QEP_A and QEP_B.
Use flat pliers to bend the pins down by 90 degrees.
Solder the encoder wires and apply heat shrink.
Encoder pin assignment Launchpad.
The Launchpad is now prepared.
We modify the screw terminals on the booster packs.
This is optional - you can also route the wires differently.
Both booster packs have to be connected to the power supply.
Loosen the screws on the screw terminal as much as possible.
Use a small screwdriver to bend the metal clips outwards.
Repeat for all 5 metal clips.
Push on the screws from the bottom side and remove them.
Keep the screws for reinstalling them later.
Remove the metal clips - they are no longer needed.
Mark the hole locations on the two pin power terminal with a thin pen.
Use your fingers or pliers to push the plastic covers inwards.
It helps to gently rotate and wiggle the cover.
Remove the power terminal and the motor phase terminal covers.
Drill the plastic cover in the two locations that you have marked before.
Start with a 2mm drill, then drill with 2,5mm and finally with 3mm.
Reinstall the plastic covers.
The cover of the 2 pin power terminal is installed as before.
Rotate the 3 pin cover by 180 degrees and install it reversed.
On the bottom booster pack we only modify the 3 pin phase terminal.
The two pin power terminal can remain unchanged. (picture above - right side)
Prepare the power supply wire - we use 1mm² wire.
Carefully cut into the insulation with a cutter.
Rotate the wire and cut all the way around.
Cut the insulation again with an offset of about 5mm.
Carefully cut a part of the insulation off.
Remove the rest of the separated insulation with your fingers.
Twist the wire and apply solder.
Repeat the same steps for the power supply ground wire.
Shorten the wires to about 7cm, remove 5mm of the insulation and apply solder.
You can place the booster packs on the launchpad to determine the wire lenght.
Install the 4mm connectors for the power supply.
The power supply wires are now prepared.
Prepare the six motor phase wires and connectors.
We use 0,5mm² wire and 2mm connectors.
Solder the connectors, apply heat shrink and label the motor phases.
Install the power wire and the motor phase wires.
The booster packs are now prepared.
Install the two booster packs on the bottom of the launchpad.
Make sure that the pin headers are lined up correctly.
The TI dual motor driver electronics are now ready to be used with the actuator modules.
- For running the motor driver board from flash set the dip switch to: ON - ON - OFF
- For programming the motor driver board via USB set the dip switch to: ON - ON - ON
Dual Channel CAN card
9 pin D-sub connector
- for CAN communication we use a dual channel can card
- the pin assignment of the 9 pole D-sub connector is documented here: CAN Connector Wiring
- flash the Launchpad via USB with dip switch setting ON - ON - ON
- then set the dip switches to ON - ON - OFF (run from flash) for motor control via CAN
Open Dynamic Robot Initiative - Webpage
Open Dynamic Robot Initiative - YouTube Channel
Open Dynamic Robot Initiative - Forum
Open Dynamic Robot Initiative - Paper
Hardware Overview
Software Overview
Back to Electronics Overview
Felix Grimminger
BSD 3-Clause License
Copyright (c) 2019-2021, Max Planck Gesellschaft and New York University